Futurum’s New Silicon Data Helps Vendors Understand Complex AI Hardware Supply Chain for Strategic Planning — Report Summary
Ray Wang, Research Director for Semiconductors, Supply Chain, and Emerging Technology, shares insights on Futurum’s new Silicon Tracker dataset, aiming to help industry leaders understand the AI hardware supply chain.
GPUs Cornerstone, XPUs Rise: $546B Data Center Semiconductor Market
Ray Wang, Research Director for Semiconductors, Supply Chain, and Emerging Technology at Futurum, shares the key findings and insights from the newly launched 2H 2025 Data Center Semiconductor Decision Maker Survey and Q2 2025 Data Center Spot Check Report.
2025 OCP Summit—AI Infrastructure Buildout Consisted of Three Pillars: AI Servers Rack, Power & Cooling, and Networking
Ray Wang, Research Director for Semiconductors, Supply Chain, and Emerging Technology at Futurum, shares his insights and observations during the OCP Global Summit 2025, focusing on AI infrastructure.
Lattice Launches New FPGA for Quantum Security
Ray Wang, Research Director at Futurum, shares his insights on Lattice MachXO5-NX TDQ, the first CNSA 2.0-compliant PQC-ready secure control FPGA, highlighting its crypto-agility, Root of Trust, and quantum-resistant security capabilities.
Could QumulusAI–USD.AI Financing Model Be a New Model for AI Infrastructure Capital
Ray Wang and Daniel Newman at Futurum share their insights on how QumulusAI USD.AI financing uses tokenized GPU collateral and stablecoin liquidity to fund up to 70% of deployments, enabling faster infrastructure scaling.
AMD OpenAI Partnership: Scale Win or Execution Risk at 6 GW?
Ray Wang, Research Director at Futurum, shares his insights on the AMD OpenAI partnership spanning 6 GW of Instinct GPUs, where milestone-linked warrants and power readiness define the next phase of AI infrastructure execution.
Hybrid Bonding at Scale: Powering the Next Era of Semiconductor Packaging
In our latest Market Brief, Hybrid Bonding at Scale: Powering the Next Era of Semiconductor Packaging, developed in partnership with Applied Materials, Futurum Research explores how hybrid bonding is transforming semiconductor manufacturing and enabling next-generation AI and HPC performance through the industry’s first fully integrated die-to-wafer hybrid bonding platform.
Can Lenovo’s GPU Services Close the AI Infrastructure Gap in Enterprises?
Ray Wang, Research Director at Futurum, shares his insights on Lenovo GPU Advanced Services, a modular suite designed to boost AI workload performance by up to 30% while simplifying GPU deployment, management, and scaling.
IBM and AMD Team with Zyphra to Build AI Infrastructure on IBM Cloud
Ray Wang, Research Director at Futurum, shares insights on IBM and AMD’s partnership with Zyphra to deliver one of the largest AI training clusters on IBM Cloud, advancing Zyphra’s $1 billion open-source superintelligence initiative.
Micron Q4 FY 2025 Earnings Top Estimates on DRAM and HBM Strength
Ray Wang and Daniel Newman at Futurum analyze Micron’s Q4 FY 2025 earnings, focusing on record data center momentum, HBM growth, and margin expansion, while highlighting how AI demand positions the company firmly for FY 2026.
Can Synopsys and TSMC Accelerate Next-Gen Chip Design With AI?
Ray Wang, Research Director at Futurum, shares insights on Synopsys and TSMC’s expanded collaboration on certified flows, IP, and 3DIC solutions to accelerate AI and multi-die chip design across advanced semiconductor nodes.
How Intel–NVIDIA Partnership Could Reshape the Semiconductor Supply Chain – Report Summary
Ray Wang, Research Director for Semiconductors, Supply Chain, and Emerging Technologies, and Nick Patience, VP & AI Practice Lead at Futurum, share their perspectives on the broad impacts of the recent Intel–NVIDIA partnership across the semiconductor supply chain.
